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Jar Design A330 BEST Crack 79

Jar Design A330 Crack 79 > https://shoxet.com/2tjicf

the cj fabrication methodology is conceptually illustrated in figure 1a. a thin (100nm) pt electrode layer is deposited on top of a sacrificial layer on a silicon wafer substrate using thermal evaporation. the electrode layer must exhibit residual internal tensile stress and brittle fracture behavior. after photolithography and plasma etching of the electrode layer, a 1-um-thick resist layer is deposited as a sacrificial layer to selectively etch away the sacrificial layer during a later isotropic etch. the substrate is then transferred into a koh solution, which removes the sacrificial layer. during the etch, the electrode-bridge is detached from the substrate and the stored elastic strain redistributes to maintain equilibrium of stresses. this causes the build-up of stress at the notch of the electrode-bridge. once the local stress level at the notch overcomes the strength of the electrode material, a crack is initiated at the notch. this results in a fracture across the notched constriction (neck) of the electrode-bridge, contraction of the free-standing electrodes in opposite directions, and the formation of a nanoscale gap that is separating the electrodes, as illustrated in figure 1a (inset of bottom panel). the internal stress initially stored in the electrode-bridge is converted to an accurate and predictable self-generated retraction of the electrodes after crack formation. the length of the suspended part of the electrode-bridge defines the width of the resulting nanogap, whereby short electrode-bridges yield small gap-widths. as shown in figure 1b, l and w are proportional to each other with the stored elastic strain of the electrode layer as proportionality constant with2: 84d34552a1